Amphenol Corporation BergStik ® 77317-403-34LF

BergStik® 2.54mm unshrouded headers are designed for versatile interconnect solutions, including Board-to-Board, Wire-to-Board, and Cable-to-Board applications. This product is available in various configurations such as surface-mount, through-hole, and press-fit, with options for stacking and pin-in-paste designs. The headers feature a breakaway design, allowing customization to specific lengths, and support a maximum current rating of 3A per contact. Constructed from high-temperature thermoplastic material, these headers are compatible with multiple soldering processes, including wave and reflow. They are rated for up to 100 mating cycles and have a dielectric withstand voltage of 1500V. The product meets RoHS compliance and is suitable for a wide range of electronic applications, making it a cost-effective choice for engineers seeking reliable interconnect solutions.