Amphenol Communications Solutions Bergstak ® 61082-163502LF

The BergStak® 0.80mm mezzanine connector series is a vertical board-to-board interconnect system supporting up to 12 Gb/s signaling, with 20 to 200 positions in 20-position increments and stack heights from 5 mm to 20 mm in 1 mm increments. The housing is made of glass-filled LCP (UL 94 V-0), with contacts featuring gold or gold flash over palladium-nickel plating and matte tin solder terminations. It has a 0.80 mm double-row contact pitch, scoop-proof housing, and is RoHS compliant. Operational temperature ranges from -40 °C to +125 °C, with 100 mating cycles durability, 0.9 N max mating force per contact, and current rating of 0.8 A per contact. Signal integrity specifications include differential impedance of 81 to 108 Ω, return loss below 10 dB up to 5 GHz, and insertion loss under 1.5 dB up to 5 GHz. Packaging is available in tape & reel or tubes.