ELANTAS North America LLC ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit 119840

Description
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.
Request a Quote Datasheet
Description
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit - E 813-9 HI TEMP 100GM KIT - Ellsworth Adhesives
Germantown, WI, USA
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit
E 813-9 HI TEMP 100GM KIT
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit E 813-9 HI TEMP 100GM KIT
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.

ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Sealants
Product Number E 813-9 HI TEMP 100GM KIT
Product Name ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit
Cure / Technology Two Component  
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details
Potting Compounds - 2349625 - RS Components, Ltd.
RS Components, Ltd.
Specs
Features Encapsulant, Potting Compound
Use Temperature -40 to 347 F (-40 to 175 C)
Thermal Conductivity 0.5000 W/m-K (0.2889 BTU-ft/hr-ft²-F)
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
Formulations - Applications - Sealing - Cylinlock 820 - 382030 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; Room Temperature Vulcanizing or Curing
Features Threadlocker or Retainer
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details