Alliance Memory, Inc. Memory AS6C1616B-55BINTR

Description
SRAM - Asynchronous Memory IC 16Mb (1M x 16) Parallel 55ns 48-TFBGA (6x8)
Request a Quote Datasheet
Description
SRAM - Asynchronous Memory IC 16Mb (1M x 16) Parallel 55ns 48-TFBGA (6x8)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 1450-AS6C1616B-55BINTR-ND - DigiKey
Thief River Falls, MN, United States
SRAM - Asynchronous Memory IC 16Mb (1M x 16) Parallel 55ns 48-TFBGA (6x8)

SRAM - Asynchronous Memory IC 16Mb (1M x 16) Parallel 55ns 48-TFBGA (6x8)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - AS6C1616B-55BINTR - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
AS6C1616B-55BINTR
Integrated Circuits (ICs) - Memory - Memory AS6C1616B-55BINTR
IC SRAM 16MBIT PARALLEL 48TFBGA

IC SRAM 16MBIT PARALLEL 48TFBGA

Supplier's Site
Memory - AS6C1616B-55BINTR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SRAM - Asynchronous Memory IC 16Mbit Parallel 55 ns 48-TFBGA (6x8)

SRAM - Asynchronous Memory IC 16Mbit Parallel 55 ns 48-TFBGA (6x8)

Buy Now Datasheet

Technical Specifications

  DigiKey Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number 1450-AS6C1616B-55BINTR-ND AS6C1616B-55BINTR AS6C1616B-55BINTR
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category SRAM Chip Volatile; SRAM Chip SRAM; SRAM Chip
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Density 16000 kbits 16000 kbits 16000 kbits
Package Type 48-LFBGA BGA; 48-TFBGA (6x8) BGA; 48-LFBGA
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 16-4043-01 - Quarktwin Technology Ltd.
Infineon Technologies AG
View Details
2 suppliers
Logic - FIFOs Memory - 67413AJ - Lingto Electronic Limited
Rochester Electronics
Specs
Data Rate 35 MHz
Operating Current 240 mA
View Details
Flash Memory - 1882749P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 2048000 kbits
Package Type SOIC; SOIC
View Details
Memory - MYX4DD3K256M16BG1 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DDR3
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 256000 kbits
View Details