IC DRAM 2GBIT PARALLEL 134FBGA Product overview: AS4C64M32MD2-25BCN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C64M32MD2-25B
IC DRAM 2GBIT PARALLEL 134FBGA
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SDRAM - Mobile LPDDR2 Memory IC 2Gbit Parallel 400 MHz 134-FBGA (10x11.5)
IC DRAM 2GBIT PARALLEL 134FBGA
| ERSAELECTRONICS PTE. LTD. | Shenzhen Shengyu Electronics Technology Limited | Karl Kruse GmbH & Co. KG | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-AS4C64M32MD2-25BCN | AS4C64M32MD2-25BCN | AS4C64M32MD2-25BCN | AS4C64M32MD2-25BCN | AS4C64M32MD2-25BCN |
| Product Name | Memory IC and Storage Component | Integrated Circuits (ICs) - Memory | Mobile DDR2 2Gb 128Mx16 BGA134 | Memory | Memory |
| Memory Category | Volatile; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip | |
| Cycle Time | 15 ns | ||||
| Operating Temperature | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | -30 to 85 C (-22 to 185 F) | ||
| Address Bus Width | 32 bits | ||||
| Package Type | BGA; Tray | BGA | 134-ball FBGA (10x11.5x1.0) | BGA; 134-VFBGA |