Alliance Memory, Inc. DRAM AS4C512M32MD3-15BCN

Description
Category: DRAM Win Source Part Number: 1447533-AS4C512M32MD 3-15BCN Manufacturer: Alliance Memory, Inc.
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Description
Category: DRAM Win Source Part Number: 1447533-AS4C512M32MD 3-15BCN Manufacturer: Alliance Memory, Inc.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
DRAM - 1447533-AS4C512M32MD3-15BCN - Win Source Electronics
Laguna Hills, CA, United States
Category: DRAM Win Source Part Number: 1447533-AS4C512M32MD 3-15BCN Manufacturer: Alliance Memory, Inc.

Category: DRAM
Win Source Part Number: 1447533-AS4C512M32MD3-15BCN
Manufacturer: Alliance Memory, Inc.

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Memory IC and Storage Component - 774-AS4C512M32MD3-15BCN - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-AS4C512M32MD3-15BCN
Memory IC and Storage Component 774-AS4C512M32MD3-15BCN
IC DRAM 16GBIT PAR 178FBGA Product overview: AS4C512M32MD3-15BCN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C512M32MD3-15 BCN can be used for catalog matching and distributor lookup.

IC DRAM 16GBIT PAR 178FBGA Product overview: AS4C512M32MD3-15BCN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C512M32MD3-15BCN can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - AS4C512M32MD3-15BCN - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
AS4C512M32MD3-15BCN
Integrated Circuits (ICs) - Memory AS4C512M32MD3-15BCN
IC DRAM 16GBIT PARALLEL 178FBGA

IC DRAM 16GBIT PARALLEL 178FBGA

Supplier's Site
IC DRAM 16GBIT PARALLEL 178FBGA

IC DRAM 16GBIT PARALLEL 178FBGA

Supplier's Site Datasheet
Memory - AS4C512M32MD3-15BCN - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR3 Memory IC 16Gbit Parallel 667 MHz 178-FBGA (11x11.5)

SDRAM - Mobile LPDDR3 Memory IC 16Gbit Parallel 667 MHz 178-FBGA (11x11.5)

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Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 1447533-AS4C512M32MD3-15BCN 774-AS4C512M32MD3-15BCN AS4C512M32MD3-15BCN AS4C512M32MD3-15BCN AS4C512M32MD3-15BCN
Product Name DRAM Memory IC and Storage Component Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Cycle Time 15 ns
Operating Temperature -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F) -25 to 85 C (-13 to 185 F)
Package Type BGA; Tray BGA BGA; 178-VFBGA
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