Alliance Memory, Inc. Memory - SDRAM - AS4C32M32MD2A-25BIN AS4C32M32MD2A-25BIN

Description
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911725-AS4C32M32MD2A -25BIN Operating Temperature Range: -40°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 1Gb (32M x 32) Parallel 134-FBGA (10x11.5) Package: 134-VFBGA Package: Tray Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 134-FBGA (10x11.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 64 pct. Supply and Demand Status: Balance Quantity per package: 128 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0032
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Description
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911725-AS4C32M32MD2A -25BIN Operating Temperature Range: -40°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 1Gb (32M x 32) Parallel 134-FBGA (10x11.5) Package: 134-VFBGA Package: Tray Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 134-FBGA (10x11.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 64 pct. Supply and Demand Status: Balance Quantity per package: 128 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0032
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Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - AS4C32M32MD2A-25BIN - 911725-AS4C32M32MD2A-25BIN - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - AS4C32M32MD2A-25BIN
911725-AS4C32M32MD2A-25BIN
Memory - SDRAM - AS4C32M32MD2A-25BIN 911725-AS4C32M32MD2A-25BIN
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911725-AS4C32M32MD2A -25BIN Operating Temperature Range: -40°C ~ 85°C (TC) Features: SDRAM - Mobile LPDDR2 Memory IC 1Gb (32M x 32) Parallel 134-FBGA (10x11.5) Package: 134-VFBGA Package: Tray Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 134-FBGA (10x11.5) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 64 pct. Supply and Demand Status: Balance Quantity per package: 128 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0032

Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911725-AS4C32M32MD2A-25BIN
Operating Temperature Range: -40°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR2 Memory IC 1Gb (32M x 32) Parallel 134-FBGA (10x11.5)
Package: 134-VFBGA
Package: Tray
Mounting: Surface Mount
Family Name: AS4C32
Categories: Integrated Circuits (ICs)
Case / Package: 134-FBGA (10x11.5)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 64 pct.
Supply and Demand Status: Balance
Quantity per package: 128
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 29 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0032

Buy Now Datasheet
Memory IC and Storage Component - 774-AS4C32M32MD2A-25BIN - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-AS4C32M32MD2A-25BIN
Memory IC and Storage Component 774-AS4C32M32MD2A-25BIN
IC DRAM 1GBIT PARALLEL 134FBGA Product overview: AS4C32M32MD2A-25BIN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C32M32MD2A-25 BIN can be used for catalog matching and distributor lookup.

IC DRAM 1GBIT PARALLEL 134FBGA Product overview: AS4C32M32MD2A-25BIN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C32M32MD2A-25BIN can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
IC DRAM 1GBIT PARALLEL 134FBGA

IC DRAM 1GBIT PARALLEL 134FBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - AS4C32M32MD2A-25BIN - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
AS4C32M32MD2A-25BIN
Integrated Circuits (ICs) - Memory AS4C32M32MD2A-25BIN
IC DRAM 1GBIT PARALLEL 134FBGA

IC DRAM 1GBIT PARALLEL 134FBGA

Supplier's Site
IC DRAM 1GBIT PARALLEL 134FBGA

IC DRAM 1GBIT PARALLEL 134FBGA

Supplier's Site Datasheet
Memory - AS4C32M32MD2A-25BIN - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2 Memory IC 1Gbit Parallel 400 MHz 134-FBGA (10x11.5)

SDRAM - Mobile LPDDR2 Memory IC 1Gbit Parallel 400 MHz 134-FBGA (10x11.5)

Buy Now Datasheet

Technical Specifications

  Win Source Electronics ERSAELECTRONICS PTE. LTD. ODG (Origin Data Global) Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 911725-AS4C32M32MD2A-25BIN 774-AS4C32M32MD2A-25BIN AS4C32M32MD2A-25BIN AS4C32M32MD2A-25BIN AS4C32M32MD2A-25BIN AS4C32M32MD2A-25BIN
Product Name Memory - SDRAM - AS4C32M32MD2A-25BIN Memory IC and Storage Component Memory Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip SDRAM - Mobile LPDDR2; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Package Type BGA; 134-FBGA (10x11.5) BGA; Tray 134-VFBGA BGA BGA; 134-VFBGA
Access Time 5.5 ns
Cycle Time 15 ns
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