Alliance Memory, Inc. Memory - SDRAM - AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR

Description
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911724-AS4C32M16MD1A -5BCNTR Operating Temperature Range: -30°C ~ 85°C (TJ) Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9) Package: 60-VFBGA Package: Reel - TR Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 60-FBGA (8x9) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 94 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0028
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Description
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911724-AS4C32M16MD1A -5BCNTR Operating Temperature Range: -30°C ~ 85°C (TJ) Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9) Package: 60-VFBGA Package: Reel - TR Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 60-FBGA (8x9) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 94 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0028
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - AS4C32M16MD1A-5BCNTR - 911724-AS4C32M16MD1A-5BCNTR - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - AS4C32M16MD1A-5BCNTR
911724-AS4C32M16MD1A-5BCNTR
Memory - SDRAM - AS4C32M16MD1A-5BCNTR 911724-AS4C32M16MD1A-5BCNTR
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911724-AS4C32M16MD1A -5BCNTR Operating Temperature Range: -30°C ~ 85°C (TJ) Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9) Package: 60-VFBGA Package: Reel - TR Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 60-FBGA (8x9) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 94 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0028

Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911724-AS4C32M16MD1A-5BCNTR
Operating Temperature Range: -30°C ~ 85°C (TJ)
Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9)
Package: 60-VFBGA
Package: Reel - TR
Mounting: Surface Mount
Family Name: AS4C32
Categories: Integrated Circuits (ICs)
Case / Package: 60-FBGA (8x9)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 94 pct.
Supply and Demand Status: Balance
Quantity per package: 2000
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 29 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0028

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - AS4C32M16MD1A-5BCNTR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
AS4C32M16MD1A-5BCNTR
Integrated Circuits (ICs) - Memory AS4C32M16MD1A-5BCNTR
IC DRAM 512MBIT PARALLEL 60FBGA

IC DRAM 512MBIT PARALLEL 60FBGA

Supplier's Site
Memory - AS4C32M16MD1A-5BCNTR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR Memory IC 512Mbit Parallel 200 MHz 700 ps 60-FBGA (8x9)

SDRAM - Mobile LPDDR Memory IC 512Mbit Parallel 200 MHz 700 ps 60-FBGA (8x9)

Buy Now Datasheet
IC DRAM 512MBIT PARALLEL 60FBGA

IC DRAM 512MBIT PARALLEL 60FBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 911724-AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR
Product Name Memory - SDRAM - AS4C32M16MD1A-5BCNTR Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F)
Package Type BGA; 60-FBGA (8x9) BGA BGA; 60-VFBGA
Data Rate 200 MHz
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