Alliance Memory, Inc. Memory - SDRAM - AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR

Description
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911724-AS4C32M16MD1A -5BCNTR Operating Temperature Range: -30°C ~ 85°C (TJ) Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9) Package: 60-VFBGA Package: Reel - TR Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 60-FBGA (8x9) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 94 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0028
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Description
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911724-AS4C32M16MD1A -5BCNTR Operating Temperature Range: -30°C ~ 85°C (TJ) Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9) Package: 60-VFBGA Package: Reel - TR Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 60-FBGA (8x9) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 94 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0028
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - SDRAM - AS4C32M16MD1A-5BCNTR - 911724-AS4C32M16MD1A-5BCNTR - Win Source Electronics
Laguna Hills, CA, United States
Memory - SDRAM - AS4C32M16MD1A-5BCNTR
911724-AS4C32M16MD1A-5BCNTR
Memory - SDRAM - AS4C32M16MD1A-5BCNTR 911724-AS4C32M16MD1A-5BCNTR
Manufacturer: Alliance Memory, Inc. Win Source Part Number: 911724-AS4C32M16MD1A -5BCNTR Operating Temperature Range: -30°C ~ 85°C (TJ) Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9) Package: 60-VFBGA Package: Reel - TR Mounting: Surface Mount Family Name: AS4C32 Categories: Integrated Circuits (ICs) Case / Package: 60-FBGA (8x9) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 94 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) Estimated Pruduction Lead Time: 29 Weeks REACH Status: REACH Unaffected HTSUS: 8542.32.0028

Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911724-AS4C32M16MD1A-5BCNTR
Operating Temperature Range: -30°C ~ 85°C (TJ)
Features: SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200 MHz 700 ps 60-FBGA (8x9)
Package: 60-VFBGA
Package: Reel - TR
Mounting: Surface Mount
Family Name: AS4C32
Categories: Integrated Circuits (ICs)
Case / Package: 60-FBGA (8x9)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 94 pct.
Supply and Demand Status: Balance
Quantity per package: 2000
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 29 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0028

Buy Now Datasheet
Memory - AS4C32M16MD1A-5BCNTR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR Memory IC 512Mbit Parallel 200 MHz 700 ps 60-FBGA (8x9)

SDRAM - Mobile LPDDR Memory IC 512Mbit Parallel 200 MHz 700 ps 60-FBGA (8x9)

Buy Now Datasheet
IC DRAM 512MBIT PARALLEL 60FBGA

IC DRAM 512MBIT PARALLEL 60FBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - AS4C32M16MD1A-5BCNTR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
AS4C32M16MD1A-5BCNTR
Integrated Circuits (ICs) - Memory AS4C32M16MD1A-5BCNTR
IC DRAM 512MBIT PARALLEL 60FBGA

IC DRAM 512MBIT PARALLEL 60FBGA

Supplier's Site

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 911724-AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR AS4C32M16MD1A-5BCNTR
Product Name Memory - SDRAM - AS4C32M16MD1A-5BCNTR Memory Memory Integrated Circuits (ICs) - Memory
Memory Category DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip
Operating Temperature -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F) -30 to 85 C (-22 to 185 F)
Package Type BGA; 60-FBGA (8x9) BGA; 60-VFBGA BGA
Access Time 0.7000 ns 0.7000 ns 0.7000 ns
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