Alliance Memory, Inc. Memory AS4C32M16D2C-25BIN

Description
SDRAM - DDR2 Memory IC 512Mbit SSTL_18 400 MHz 0.4 ns 84-FBGA (8x12.5)
Datasheet
Description
SDRAM - DDR2 Memory IC 512Mbit SSTL_18 400 MHz 0.4 ns 84-FBGA (8x12.5)
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - AS4C32M16D2C-25BIN - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - DDR2 Memory IC 512Mbit SSTL_18 400 MHz 0.4 ns 84-FBGA (8x12.5)

SDRAM - DDR2 Memory IC 512Mbit SSTL_18 400 MHz 0.4 ns 84-FBGA (8x12.5)

Buy Now Datasheet
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
AS4C32M16D2C-25BIN
Integrated Circuits (ICs) - Memory - Memory AS4C32M16D2C-25BIN
IC DRAM 512MBIT SSTL 18 84FBGA

IC DRAM 512MBIT SSTL 18 84FBGA

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category Memory Chips Memory Chips
Product Number AS4C32M16D2C-25BIN AS4C32M16D2C-25BIN
Product Name Memory Integrated Circuits (ICs) - Memory - Memory
Memory Category DRAM; DRAM Chip Volatile; DRAM Chip
Access Time 0.4000 ns
Operating Temperature -40 to 95 C (-40 to 203 F)
Density 512000 kbits 512000 kbits
Unlock Full Specs
to access all available technical data

Similar Products

Memory IC and Storage Component - 736-DP8409AD - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
2 suppliers
Logic - FIFOs Memory - 67402J - Lingto Electronic Limited
Rochester Electronics
Specs
Data Rate 10 MHz
Access Time 45 ns
Operating Current 180 mA
View Details
Memory - AS28F128J3A - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category FLASH
Access Time 115 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details