Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 861923-AS4C256M16D3L
Operating Temperature Range: 0°C ~ 95°C (TC)
Features: SDRAM - DDR3L Memory IC 4Gb (256M x 16) Parallel 800 MHz 20 ns 96-FBGA (9x13)
Package: Tray
Package: 96-VFBGA
Mounting: Surface Mount
Part Status: Obsolete
Categories: Integrated Circuits (ICs)
Case / Package: 96-FBGA (9x13)
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 74 pct.
Supply and Demand Status: Limited
Quantity per package: 190
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036
IC DRAM 4GBIT PARALLEL 96FBGA Product overview: AS4C256M16D3LA-12BCN
IC DRAM 4GBIT PARALLEL 96FBGA
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IC DRAM 4GBIT PARALLEL 96FBGA
IC DRAM 4GBIT PARALLEL 96FBGA
SDRAM - DDR3L Memory IC 4Gbit Parallel 800 MHz 20 ns 96-FBGA (9x13)
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | ODG (Origin Data Global) | Karl Kruse GmbH & Co. KG | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 861923-AS4C256M16D3LA-12BCN | 774-AS4C256M16D3LA-12BCN | AS4C256M16D3LA-12BCN | AS4C256M16D3LA-12BCN | AS4C256M16D3LA-12BCN | AS4C256M16D3LA-12BCN | AS4C256M16D3LA-12BCN |
| Product Name | Memory - SDRAM - AS4C256M16D3LA-12BCN | Memory IC and Storage Component | Memory | DDR3 4Gb 256x16 1.35V BGA96 | Integrated Circuits (ICs) - Memory | Memory | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | SDRAM - DDR3L; DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip | |
| Operating Temperature | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | ||
| Package Type | BGA; 96-FBGA (9x13) | BGA; Tray | 96-VFBGA | 96-ball FBGA | BGA | BGA; 96-VFBGA | |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |