The AS4C256M16D3-12BIN is a 4Gb DDR3 Synchronous DRAM organized as 256M x 16 bits across eight banks. It supports high-speed operation with a double data rate of up to 1600 Mb/sec per pin, making it suitable for general applications. The device operates with a single power supply of 1.5V ¬± 0.075V and is available in a 96-ball FBGA package measuring 9 x 13 x 1.2mm. This memory chip is compliant with JEDEC standards and features fully synchronous operation, a fast clock rate of 800 MHz, and supports various programmable modes including burst lengths of 4 and 8. It operates within a temperature range of -40¬8C to 95¬8C, making it suitable for industrial applications. The device includes features such as dynamic ODT, auto refresh, and self-refresh capabilities, along with a robust refresh cycle specification. The AS4C256M16D3-12BIN is RoHS compliant, ensuring it meets environmental regulations.
Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911719-AS4C256M16D3-
Operating Temperature Range: -40°C ~ 95°C (TC)
Features: SDRAM - DDR3 Memory IC 4Gb (256M x 16) Parallel 800 MHz 20 ns 96-FBGA (9x13)
Package: Tray
Package: 96-TFBGA
Mounting: Surface Mount
Part Status: Discontinued at Digi-Key
Categories: Integrated Circuits (ICs)
Case / Package: 96-FBGA (9x13)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 53 pct.
Supply and Demand Status: Balance
Quantity per package: 190
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036
IC DRAM 4GBIT PARALLEL 96FBGA Product overview: AS4C256M16D3-12BIN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C256M16D3-12B
IC DRAM 4GBIT PARALLEL 96FBGA
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SDRAM - DDR3 Memory IC 4Gbit Parallel 800 MHz 20 ns 96-FBGA (9x13)
IC DRAM 4GBIT PARALLEL 96FBGA
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | Shenzhen Shengyu Electronics Technology Limited | Karl Kruse GmbH & Co. KG | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 911719-AS4C256M16D3-12BIN | 774-AS4C256M16D3-12BIN | AS4C256M16D3-12BIN | AS4C256M16D3-12BIN | AS4C256M16D3-12BIN | AS4C256M16D3-12BIN |
| Product Name | Memory - SDRAM - AS4C256M16D3-12BIN | Memory IC and Storage Component | Integrated Circuits (ICs) - Memory | DDR3 SDRAM,4G,256M x 161.5V,96-ball FBGA | Memory | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | Volatile; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | ||
| Package Type | BGA; 96-FBGA (9x13) | BGA; Tray | BGA | 96-ball FBGA | BGA; 96-TFBGA | |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns |
