Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911713-AS4C128M16D3-
Operating Temperature Range: -40°C ~ 95°C (TC)
Features: SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 800 MHz 20 ns 96-FBGA (9x13)
Package: Tray
Package: 96-TFBGA
Mounting: Surface Mount
Part Status: Discontinued at Digi-Key
Categories: Integrated Circuits (ICs)
Case / Package: 96-FBGA (9x13)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 54 pct.
Supply and Demand Status: Balance
Quantity per package: 190
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036
IC DRAM 2GBIT PARALLEL 96FBGA Product overview: AS4C128M16D3-12BIN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C128M16D3-12B
IC DRAM 2GBIT PARALLEL 96FBGA
IC DRAM 2GBIT PARALLEL 96FBGA
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SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 96-FBGA (9x13)
IC DRAM 2GBIT PARALLEL 96FBGA
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | ODG (Origin Data Global) | Shenzhen Shengyu Electronics Technology Limited | Karl Kruse GmbH & Co. KG | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 911713-AS4C128M16D3-12BIN | 774-AS4C128M16D3-12BIN | AS4C128M16D3-12BIN | AS4C128M16D3-12BIN | AS4C128M16D3-12BIN | AS4C128M16D3-12BIN | AS4C128M16D3-12BIN |
| Product Name | Memory - SDRAM - AS4C128M16D3-12BIN | Memory IC and Storage Component | Memory | Integrated Circuits (ICs) - Memory | DDR3 SDRAM,2G,128M x 161.5V,96-ball FBGA | Memory | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | SDRAM - DDR3; DRAM Chip | Volatile; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | ||
| Package Type | BGA; 96-FBGA (9x13) | BGA; Tray | 96-TFBGA | BGA | 96-ball FBGA | BGA; 96-TFBGA | |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
