Product Description
ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold cured, and the cured compound is a tough resin.
The resin exhibits superior adhesion to a rage of materials, and maintains this even in harsh environments including under some chemical conditions. It also shows good electrical properties
Key properties
Excellent adhesion to a wide variety of substrates
Good bond strength - even in harsh conditions
Mix ratio can be altered to vary flexibility
Good electrical properties
Can be used as an adhesive or encapsulant
RoHS Compliant
Product Description
ER1122 adhesive epoxy resin is a two part encapsulation and potting compound for general purpose electronic applications with a clear amber finish. It can be hot or cold cured, and the cured compound is a tough resin.
The resin exhibits superior adhesion to a rage of materials, and maintains this even in harsh environments including under some chemical conditions. It also shows good electrical properties
Key properties
- Excellent adhesion to a wide variety of substrates
- Good bond strength - even in harsh conditions
- Mix ratio can be altered to vary flexibility
- Good electrical properties
- Can be used as an adhesive or encapsulant
- RoHS Compliant