ALPHA OM-5100 is a low-residue, no-clean solder paste designed for high-yield SMT assembly, compatible with fine-pitch printing down to 0.3 mm apertures and print speeds up to 150 mm/sec. It is formulated with 62Sn/36Pb/2Ag, 63Sn/37Pb, 5Sn/92.5Pb/2.5Ag, or 62.8Sn/36.8Pb/0.4Ag alloys using Type 3 or Type 4 powder per IPC J-STD-005, and is available in 500 gram jars, 6 inch and 12 inch cartridges, and DEK ProFlow cassettes. The paste exhibits halide-free composition, passes IPC J-STD-004 electrical reliability tests including SIR of 2.6×10⁹ ohms at 85°C/85% RH, and demonstrates minimal solder balling and slump under standard reflow profiles. It supports assembly of both tin-lead and lead-free components with a wide reflow window, and requires refrigerated storage at 0 to 10 °C with a six-month shelf life.
Product Overview
ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste designed to maximize first-pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and minimize post-reflow soldering defects.
This paste's wide reflow profile window enables soldering with lead-free components. ALPHA OM-5100 is engineered for complex assemblies with small (0201) tin-finished passives and ensures solderability with large (1mm pitch) Ball Grid Array (BGA) components containing lead-free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres.
Product Features
Consistent Fine-Feature Print Volume Repeatability
Low Post-Reflow Residue
Reduction in Mid-Chip Solder Ball Defects
Minimizes Random Solder Balling
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® OM-5100 Solder Paste |
| Product Name | Solder Paste Materials for Printed Circuit Boards (PCB) |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
