ALPHA OM-377 is a lead-free, no-clean solder paste designed for ultra-fine feature printing and high electrochemical reliability in high-density PCB assemblies, supporting components as small as 100 µm × 150 µm (01005). It uses SAC305 and Innolot alloys with Type 5 powder and comes in 500 gram jars or 600 and 1200 gram cartridges. The paste achieves >1.33 Cpk transfer efficiency, passes Advanced SIR tests with ≥108 Ohms resistance for 7 days at 100 µm spacing, and exhibits minimal post-reflow residue. It is halogen-free, compliant with RoHS Directive EU/2015/863, and maintains consistent stencil life for 8 hours at ambient and elevated temperatures. Storage requires refrigeration at 0 to 10 °C for a 6-month shelf life, with a 2-week maximum at room temperature up to 25 °C.
Product Overview
ALPHA OM-377 is a lead-free, no-clean solder paste engineered for superior electrochemical reliability in fine-pitch, low-standoff SMT assemblies. Optimized for high-density PCB applications and ultra-miniaturized components down to 01005, it delivers excellent solderability, low post-reflow residue, and >1.33 Cpk transfer efficiency on fine-feature pads as small as 100 µm x 150 µm. With outstanding Head-in-Pillow (HiP) and Non-Wet Open (NWO) performance, ALPHA OM-377 is ideal for mobile, wearable, and advanced electronic assemblies requiring smaller, thinner, and lighter form factors.
Product Features
Enables Complex Miniaturized Assemblies
Superior print and reflow performance combined with ultra-fine powder technology to support complex miniaturized SMT assembly applications.
Excellent HiP and NWO Performance
Improves first-pass yield with exceptional resistance to warpage-induced Head-in-Pillow (HiP) and Non-Wet Open (NWO) defects on high I/O packages.
Robust Electrochemical Reliability
Maintains board-level electrochemical reliability on fine-pitch, low-standoff packages under stringent operating and harsh environmental conditions.
Enhanced Solderability
Enables excellent wettability and strong solder joint integrity on hard-to-wet brass and nickel surfaces.
Minimal Post-Reflow Residue
Significantly reduces post-reflow residue to help mitigate material compatibility concerns in high-density PCB assemblies.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® OM-377 Solder Paste |
| Product Name | Solder Paste Materials for Printed Circuit Boards (PCB) |
| Joining Process / Product Form | Braze or solder in the form of a paste.; Powder |
