ALPHA® OM-355 is a lead-free, zero-halogen, no-clean solder paste designed specifically for vacuum soldering applications. In-line vacuum soldering capabilities are becoming more common as power density increases on Ball Grid Array (BGA) and Bottom Terminated Component (BTC) packages require effective heat dissipation through void reduction. ALPHA® OM-355 solder paste activator system is optimized for the vacuum soldering reflow process to control the rate of volatilization and reduction in surface tension which allows voids to escape under reducing atmosphere. This promotes ultra-low voiding below 5% without the post-reflow defects commonly associated with vacuum soldering.
MacDermid Alpha Electronics Solutions
