ALPHA® OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA® OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA® OM-338-T yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.
MacDermid Alpha Electronics Solutions
