ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).ALPHA HiTech Edgebond end market is in portables such as Graphic Cards, Notebook, Tablets, as well as assembled boards in Automotive and Medical accessories.
ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.Through the selection of products, and their ability to balance viscosity, preheat, reworkability, and mechanical strength properties, users can perfectly match an ALPHA HiTech Underfill with their specific device needs, optimizing high throughput assembly.
ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each product is formulated to optimally be used for either dispensing or printing applications.ALPHA HiTech SM42-1311 is ideal for high speed dispensing applications. ALPHA HiTech SM42-120P is the product of choice for excellent printing performance requirements.