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MacDermid Alpha Electronics Solutions Edgebond ALPHA HiTech

Description
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).ALPHA HiTech Edgebond end market is in portables such as Graphic Cards, Notebook, Tablets, as well as assembled boards in Automotive and Medical accessories.
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Company
Product
Description
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Edgebond - ALPHA HiTech - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).ALPHA HiTech Edgebond end market is in portables such as Graphic Cards, Notebook, Tablets, as well as assembled boards in Automotive and Medical accessories.

ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).ALPHA HiTech Edgebond end market is in portables such as Graphic Cards, Notebook, Tablets, as well as assembled boards in Automotive and Medical accessories.

Supplier's Site
SMD Adhesives - ALPHA HiTech - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
SMD Adhesives
ALPHA HiTech
SMD Adhesives ALPHA HiTech
ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each product is formulated to optimally be used for either dispensing or printing applications.ALPHA HiTech SM42-1311 is ideal for high speed dispensing applications. ALPHA HiTech SM42-120P is the product of choice for excellent printing performance requirements.

ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each product is formulated to optimally be used for either dispensing or printing applications.ALPHA HiTech SM42-1311 is ideal for high speed dispensing applications. ALPHA HiTech SM42-120P is the product of choice for excellent printing performance requirements.

Supplier's Site
Underfills - ALPHA HiTech - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Underfills
ALPHA HiTech
Underfills ALPHA HiTech
ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.Through the selection of products, and their ability to balance viscosity, preheat, reworkability, and mechanical strength properties, users can perfectly match an ALPHA HiTech Underfill with their specific device needs, optimizing high throughput assembly.

ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.Through the selection of products, and their ability to balance viscosity, preheat, reworkability, and mechanical strength properties, users can perfectly match an ALPHA HiTech Underfill with their specific device needs, optimizing high throughput assembly.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions MacDermid Alpha Electronics Solutions MacDermid Alpha Electronics Solutions
Product Category Encapsulants and Potting Compounds Industrial Adhesives Encapsulants and Potting Compounds
Product Number ALPHA HiTech ALPHA HiTech ALPHA HiTech
Product Name Edgebond SMD Adhesives Underfills
Form / Function Liquid; Glob Top, Daub, Doming or Overfill Liquid
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