MacDermid Alpha Electronics Solutions Solder Joint Strengthening Encapsulant ALPHA® HiTech™ EN31-4007

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Solder Joint Strengthening Encapsulant - ALPHA® HiTech™ EN31-4007 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Solder Joint Strengthening Encapsulant ALPHA® HiTech™ EN31-4007
ALPHA® HiTech™ EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products prevent chip and IC devices from dropping out. For Glob Top application, these protect the chip/die from cracking.

ALPHA® HiTech™ EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products prevent chip and IC devices from dropping out. For Glob Top application, these protect the chip/die from cracking.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Encapsulants and Potting Compounds
Product Number ALPHA® HiTech™ EN31-4007
Product Name Solder Joint Strengthening Encapsulant
Industry Electronics; Semiconductors, IC's
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