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MacDermid Alpha Electronics Solutions ALPHA ® HiTech EN31-4007B Encapsulant ALPHA® HiTech™ EN31-4007

Description
ALPHA HiTech EN31-4007B is a one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. Product Overview ALPHA HiTech EN31-4007B's excellent flexibility allows it to dynamically flex in tandem with components and prevent cracking, especially in FPCB assembly process. This product has been tested to provide excellent Adhesion on FR4, Flexible Polyimide (FPC) and PET substrates. Users also have the option to rework as required since the product is highly reworkable. Product Features Excellent Impact Bending Excellent Drop Shock Excellent Impact Resistance Highly Reworkable Possesses Waterproofing Property Halogen-free and complies with RoHS Directive 2015/863/EU
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Suppliers

Company
Product
Description
Supplier Links
ALPHA ® HiTech EN31-4007B Encapsulant -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA ® HiTech EN31-4007B Encapsulant
ALPHA ® HiTech EN31-4007B Encapsulant
ALPHA HiTech EN31-4007B is a one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. Product Overview ALPHA HiTech EN31-4007B's excellent flexibility allows it to dynamically flex in tandem with components and prevent cracking, especially in FPCB assembly process. This product has been tested to provide excellent Adhesion on FR4, Flexible Polyimide (FPC) and PET substrates. Users also have the option to rework as required since the product is highly reworkable. Product Features Excellent Impact Bending Excellent Drop Shock Excellent Impact Resistance Highly Reworkable Possesses Waterproofing Property Halogen-free and complies with RoHS Directive 2015/863/EU

ALPHA HiTech EN31-4007B is a one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component.

Product Overview

ALPHA HiTech EN31-4007B's excellent flexibility allows it to dynamically flex in tandem with components and prevent cracking, especially in FPCB assembly process.

This product has been tested to provide excellent Adhesion on FR4, Flexible Polyimide (FPC) and PET substrates.

Users also have the option to rework as required since the product is highly reworkable.


Product Features

  • Excellent Impact Bending
  • Excellent Drop Shock
  • Excellent Impact Resistance
  • Highly Reworkable
  • Possesses Waterproofing Property
  • Halogen-free and complies with RoHS Directive 2015/863/EU
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Encapsulants and Potting Compounds
Product Name ALPHA ® HiTech EN31-4007B Encapsulant
Industry Semiconductors, IC's
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