ALPHA® HiTech™ EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products prevent chip and IC devices from dropping out. For Glob Top application, these protect the chip/die from cracking.
|MacDermid Alpha Electronics Solutions|
|Product Category||Encapsulants and Potting Compounds|
|Product Number||ALPHA® HiTech EN31-4007|
|Product Name||Solder Joint Strengthening Encapsulant|
|Industry||Electronics; Semiconductors, IC's|