MacDermid Alpha Electronics Solutions Underfill Epoxy for protecting assembled chip packages ALPHA® HiTech CU21-3240

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Underfill Epoxy for protecting assembled chip packages - ALPHA® HiTech CU21-3240 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Underfill Epoxy for protecting assembled chip packages ALPHA® HiTech CU21-3240
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability.
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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Encapsulants and Potting Compounds
Product Number ALPHA® HiTech CU21-3240
Product Name Underfill Epoxy for protecting assembled chip packages
Industry Electronics; Semiconductors, IC's
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