ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability.
MacDermid Alpha Electronics Solutions
Encapsulants and Potting Compounds
ALPHA® HiTech CU21-3240
Underfill Epoxy for protecting assembled chip packages