MacDermid Alpha Electronics Solutions Advanced Sintering Die Attach for Reliability ALPHA ® Argomax ® 2010C Paste

Description
Product Overview LPHA Argomax 2010C Paste is a specially designed sintering paste for high-volume, low-pressure sintering die attach. It promotes consistent, uniform printing and long stencil life, even for large dies. Formulated for printing on Ag/Au surfaces and designed for die placement on dried paste. The paste provides high performance and reliability with a pure silver bond line, offering excellent thermal and electrical conductivity. The low sintering pressure supports high-yield manufacturing.
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Description
Product Overview LPHA Argomax 2010C Paste is a specially designed sintering paste for high-volume, low-pressure sintering die attach. It promotes consistent, uniform printing and long stencil life, even for large dies. Formulated for printing on Ag/Au surfaces and designed for die placement on dried paste. The paste provides high performance and reliability with a pure silver bond line, offering excellent thermal and electrical conductivity. The low sintering pressure supports high-yield manufacturing.
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Advanced Sintering Die Attach for Reliability - ALPHA ® Argomax ® 2010C Paste - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Advanced Sintering Die Attach for Reliability
ALPHA ® Argomax ® 2010C Paste
Advanced Sintering Die Attach for Reliability ALPHA ® Argomax ® 2010C Paste
Product Overview LPHA Argomax 2010C Paste is a specially designed sintering paste for high-volume, low-pressure sintering die attach. It promotes consistent, uniform printing and long stencil life, even for large dies. Formulated for printing on Ag/Au surfaces and designed for die placement on dried paste. The paste provides high performance and reliability with a pure silver bond line, offering excellent thermal and electrical conductivity. The low sintering pressure supports high-yield manufacturing.

Product Overview

LPHA Argomax 2010C Paste is a specially designed sintering paste for high-volume, low-pressure sintering die attach. It promotes consistent, uniform printing and long stencil life, even for large dies. Formulated for printing on Ag/Au surfaces and designed for die placement on dried paste. The paste provides high performance and reliability with a pure silver bond line, offering excellent thermal and electrical conductivity. The low sintering pressure supports high-yield manufacturing.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Thick Film Materials
Product Number ALPHA ® Argomax ® 2010C Paste
Product Name Advanced Sintering Die Attach for Reliability
Thick Film Type Conductor
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