AI Technology EG8050-E is an electrically conductive, silver filled epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG8050-E can be readily reworked at 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its capability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your specific needs. EG8050-E is available in syringes for automatic needle dispensing applications or in jars. EG8050-E can be premixed and frozen. Premixed 3 cc EFD Syringe.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EG8050-E 3CC EFD SYRINGE |
| Product Name | AI Technology PRIMA-SOLDER EG8050-E Epoxy Paste Adhesive 3 cc EFD Syringe |
| Cure / Technology | Two Component (optional feature); Single Component (optional feature) |
