Semiconductor devices - Micro-electromechani
cal devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (Endorsed by AENOR in June of 2012.)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (Endorsed by AENOR in June of 2012.)