Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
| AENOR | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Name | UNE-EN 60191-6-3:2000 |
