Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
| AENOR | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Name | PNE-FprEN 60191-6-17 |
