Win Source Part Number: 1353763-XCZU9EG-3FFV
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Fake Threat In the Open Market: 51 pct.
MSL Level: 4 (72 Hours)
Mfr: AMD
Series: Zynq® UltraScale+™ MPSoC EG
Package: Tray
Product Status: Active
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Base Product Number: XCZU9
HTSUS: 8542.31.0001
REACH Status: REACH Unaffected
ECCN: 5A002A4 XIL
Speed: 600MHz, 1.5GHz
Number of I/O: 328
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
IC SOC CORTEX-A53 1156FCBGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 600MHz, 1.5GHz 1156-FCBGA (35x35)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 600MHz, 1.5GHz 1156-FCBGA (35x35)
| Win Source Electronics | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1353763-XCZU9EG-3FFVB1156E | XCZU9EG-3FFVB1156E | XCZU9EG-3FFVB1156E |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM | ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Package / Case | Tray | 1156-BBGA, FCBGA | |
| RAM Size | 0.2560 MB | 0.2560 MB | |
| Number of Inputs/Outputs | 328 # |
