Advanced Micro Devices, Inc. System On Chip (SoC) XCZU7EG-1FBVB900E

Description
IC SOC CORTEX-A53 900FCBGA
  • System On Chip (SoC) - XCZU7EG-1FBVB900E - ODG (Origin Data Global)
    ODG (Origin Data Global)
  • Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1351129-XCZU7EG-1FBVB900E - Win Source Electronics
    Win Source Electronics
  • Embedded - System On Chip (SoC) - XCZU7EG-1FBVB900E - Lingto Electronic Limited
    Lingto Electronic Limited
  • System On Chip (SoC) - XCZU7EG-1FBVB900E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
  • System On Chip (SoC) - XCZU7EG-1FBVB900E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Request a Quote Datasheet
Description
IC SOC CORTEX-A53 900FCBGA
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
System On Chip (SoC) - XCZU7EG-1FBVB900E - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XCZU7EG-1FBVB900E
System On Chip (SoC) XCZU7EG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1351129-XCZU7EG-1FBVB900E - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1351129-XCZU7EG-1FBVB900E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1351129-XCZU7EG-1FBVB900E
Win Source Part Number: 1351129-XCZU7EG-1FBV B900E Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC EG Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Speed: 500MHz, 600MHz, 1.2GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 42 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Base Product Number: XCZU7

Win Source Part Number: 1351129-XCZU7EG-1FBVB900E
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC EG
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed: 500MHz, 600MHz, 1.2GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 204
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 42 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD
Base Product Number: XCZU7

Buy Now Datasheet
Embedded - System On Chip (SoC) - XCZU7EG-1FBVB900E - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU7EG-1FBVB900E
Embedded - System On Chip (SoC) XCZU7EG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XCZU7EG-1FBVB900E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU7EG-1FBVB900E
System On Chip (SoC) XCZU7EG-1FBVB900E
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)

Buy Now
System On Chip (SoC) - XCZU7EG-1FBVB900E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU7EG-1FBVB900E
System On Chip (SoC) XCZU7EG-1FBVB900E
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)

Buy Now

Technical Specifications

  ODG (Origin Data Global) Win Source Electronics Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number XCZU7EG-1FBVB900E 1351129-XCZU7EG-1FBVB900E XCZU7EG-1FBVB900E XCZU7EG-1FBVB900E
Product Name System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 ARM ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Package / Case Tray 900-BBGA, FCBGA
Number of Inputs/Outputs 204 #
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