Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU6CG-2FFVC900E

Description
Win Source Part Number: 1183012-XCZU6CG-2FFV C900E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU6CG2FFVC900E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 68 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU6
  • System On Chip (SoC) - XCZU6CG-2FFVC900E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
  • System On Chip (SoC) - XCZU6CG-2FFVC900E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
  • Embedded - System On Chip (SoC) - XCZU6CG-2FFVC900E - Lingto Electronic Limited
    Lingto Electronic Limited
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Description
Win Source Part Number: 1183012-XCZU6CG-2FFV C900E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU6CG2FFVC900E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 68 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU6
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Suppliers

Company
Product
Description
Supplier Links
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1183012-XCZU6CG-2FFVC900E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1183012-XCZU6CG-2FFVC900E
Win Source Part Number: 1183012-XCZU6CG-2FFV C900E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU6CG2FFVC900E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 68 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU6

Win Source Part Number: 1183012-XCZU6CG-2FFVC900E
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC CG
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 533MHz, 1.3GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 204
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XCZU6CG2FFVC900E;
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 68 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XCZU6

Buy Now Datasheet
System On Chip (SoC) - XCZU6CG-2FFVC900E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU6CG-2FFVC900E
System On Chip (SoC) XCZU6CG-2FFVC900E
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

Buy Now
System On Chip (SoC) - XCZU6CG-2FFVC900E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU6CG-2FFVC900E
System On Chip (SoC) XCZU6CG-2FFVC900E
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

Buy Now
Embedded - System On Chip (SoC) - XCZU6CG-2FFVC900E - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU6CG-2FFVC900E
Embedded - System On Chip (SoC) XCZU6CG-2FFVC900E
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1183012-XCZU6CG-2FFVC900E XCZU6CG-2FFVC900E XCZU6CG-2FFVC900E
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case Tray 900-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 204 #
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