Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU6CG-2FFVB1156I

Description
Win Source Part Number: 1198619-XCZU6CG-2FFV B1156I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Bulk Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU6CG2FFVB1156I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 80 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU6
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Description
Win Source Part Number: 1198619-XCZU6CG-2FFV B1156I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Bulk Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU6CG2FFVB1156I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 80 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU6
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Suppliers

Company
Product
Description
Supplier Links
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1198619-XCZU6CG-2FFVB1156I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1198619-XCZU6CG-2FFVB1156I
Win Source Part Number: 1198619-XCZU6CG-2FFV B1156I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Bulk Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 328 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU6CG2FFVB1156I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 80 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU6

Win Source Part Number: 1198619-XCZU6CG-2FFVB1156I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC CG
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 533MHz, 1.3GHz
Package: Bulk
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 328
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XCZU6CG2FFVB1156I;
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 80 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XCZU6

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System On Chip (SoC) - XCZU6CG-2FFVB1156I - ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XCZU6CG-2FFVB1156I
System On Chip (SoC) XCZU6CG-2FFVB1156I
IC SOC CORTEX-A53 1156FCBGA

IC SOC CORTEX-A53 1156FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XCZU6CG-2FFVB1156I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU6CG-2FFVB1156I
System On Chip (SoC) XCZU6CG-2FFVB1156I
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 1156-FCBGA (35x35)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 1156-FCBGA (35x35)

Buy Now
System On Chip (SoC) - XCZU6CG-2FFVB1156I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU6CG-2FFVB1156I
System On Chip (SoC) XCZU6CG-2FFVB1156I
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 1156-FCBGA (35x35)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 533MHz, 1.3GHz 1156-FCBGA (35x35)

Buy Now
Embedded - System On Chip (SoC) - XCZU6CG-2FFVB1156I - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU6CG-2FFVB1156I
Embedded - System On Chip (SoC) XCZU6CG-2FFVB1156I
IC SOC CORTEX-A53 1156FCBGA

IC SOC CORTEX-A53 1156FCBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics ODG (Origin Data Global) Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1198619-XCZU6CG-2FFVB1156I XCZU6CG-2FFVB1156I XCZU6CG-2FFVB1156I XCZU6CG-2FFVB1156I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case Bulk 1156-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 328 #
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