Advanced Micro Devices, Inc. System On Chip (SoC) XCZU5CG-1FBVB900E

Description
IC SOC CORTEX-A53 900FCBGA
  • System On Chip (SoC) - XCZU5CG-1FBVB900E - ODG (Origin Data Global)
    ODG (Origin Data Global)
  • Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1353745-XCZU5CG-1FBVB900E - Win Source Electronics
    Win Source Electronics
  • Embedded - System On Chip (SoC) - XCZU5CG-1FBVB900E - Lingto Electronic Limited
    Lingto Electronic Limited
  • System On Chip (SoC) - XCZU5CG-1FBVB900E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
  • System On Chip (SoC) - XCZU5CG-1FBVB900E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Request a Quote Datasheet
Description
IC SOC CORTEX-A53 900FCBGA
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
System On Chip (SoC) - XCZU5CG-1FBVB900E - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XCZU5CG-1FBVB900E
System On Chip (SoC) XCZU5CG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1353745-XCZU5CG-1FBVB900E - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1353745-XCZU5CG-1FBVB900E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1353745-XCZU5CG-1FBVB900E
Win Source Part Number: 1353745-XCZU5CG-1FBV B900E Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Temperature Range - Operating: 0°C ~ 100°C (TJ) Fake Threat In the Open Market: 32 pct. MSL Level: 4 (72 Hours) Mfr: AMD Series: Zynq® UltraScale+™ MPSoC CG Package: Tray Product Status: Active Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Base Product Number: XCZU5 HTSUS: 8542.39.0001 REACH Status: REACH Unaffected ECCN: 5A002A4 XIL Speed: 500MHz, 1.2GHz Number of I/O: 204 Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

Win Source Part Number: 1353745-XCZU5CG-1FBVB900E
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Fake Threat In the Open Market: 32 pct.
MSL Level: 4 (72 Hours)
Mfr: AMD
Series: Zynq® UltraScale+™ MPSoC CG
Package: Tray
Product Status: Active
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Base Product Number: XCZU5
HTSUS: 8542.39.0001
REACH Status: REACH Unaffected
ECCN: 5A002A4 XIL
Speed: 500MHz, 1.2GHz
Number of I/O: 204
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

Buy Now Datasheet
Embedded - System On Chip (SoC) - XCZU5CG-1FBVB900E - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU5CG-1FBVB900E
Embedded - System On Chip (SoC) XCZU5CG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XCZU5CG-1FBVB900E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU5CG-1FBVB900E
System On Chip (SoC) XCZU5CG-1FBVB900E
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Buy Now
System On Chip (SoC) - XCZU5CG-1FBVB900E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU5CG-1FBVB900E
System On Chip (SoC) XCZU5CG-1FBVB900E
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

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Technical Specifications

  ODG (Origin Data Global) Win Source Electronics Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number XCZU5CG-1FBVB900E 1353745-XCZU5CG-1FBVB900E XCZU5CG-1FBVB900E XCZU5CG-1FBVB900E
Product Name System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Package / Case Tray 900-BBGA, FCBGA
Number of Inputs/Outputs 204 #
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