IC ZUP MPSOC A53 FPGA 530BGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 533MHz, 1.3GHz 530-FCBGA (16x9.5)
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 533MHz, 1.3GHz 530-FCBGA (16x9.5)
IC ZUP MPSOC A53 FPGA 530BGA
| Lingto Electronic Limited | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | XCZU3CG-2UBVA530E | XCZU3CG-2UBVA530E | XCZU3CG-2UBVA530E |
| Product Name | Embedded - System On Chip (SoC) | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
| Processor Core | ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | ARM |
| Interface | CAN; I2C; SPI; UART; USB; CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CAN; I2C; SPI; UART; USB; CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Operating Temperature | 32 to 212 F (0.0 to 100 C) | 32 to 212 F (0.0 to 100 C) |
