Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU3CG-1SFVC784I

Description
Win Source Part Number: 1261821-XCZU3CG-1SFV C784I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Package: Bulk Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 252 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 71 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU3
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Description
Win Source Part Number: 1261821-XCZU3CG-1SFV C784I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Package: Bulk Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 252 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 71 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU3
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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1261821-XCZU3CG-1SFVC784I - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1261821-XCZU3CG-1SFVC784I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1261821-XCZU3CG-1SFVC784I
Win Source Part Number: 1261821-XCZU3CG-1SFV C784I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Package: Bulk Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 252 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 71 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU3

Win Source Part Number: 1261821-XCZU3CG-1SFVC784I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC CG
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 500MHz, 1.2GHz
Package: Bulk
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 252
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 71 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XCZU3

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Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1261821-XCZU3CG-1SFVC784I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature -40 to 100 C (-40 to 212 F)
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