IC SOC CORTEX-A53 1760FCBGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 600MHz, 667MHz, 1.5GHz 1760-FCBGA (42.5x42.5)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 600MHz, 667MHz, 1.5GHz 1760-FCBGA (42.5x42.5)
| Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | XCZU19EG-3FFVD1760E | XCZU19EG-3FFVD1760E |
| Product Name | Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Interface | CAN; I2C; SPI; UART; USB; CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CAN; I2C; SPI; UART; USB; CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 32 to 212 F (0.0 to 100 C) | 32 to 212 F (0.0 to 100 C) |
