Manufacturer: AMD
Category: Integrated Circuits (ICs) Embedded System On Chip (SoC)
Series: Zynq®-7000
Package: Tray
Product Status: Active
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
IC SOC CORTEX-A9 667MHZ 1156BGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 667MHz 1156-FCBGA (35x35)
| Win Source Electronics | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | XC7Z100-1FFG1156I | XC7Z100-1FFG1156I | |
| Product Name | Integrated Circuits (ICs) Embedded System On Chip (SoC) | Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | Tray | 1156-BBGA, FCBGA | |
| RAM Size | 0.2560 MB | 0.2560 MB |
