Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z045-L2FBG676I

Description
Win Source Part Number: 1227469-XC7Z045-L2FB G676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XC7Z045L2FBG676I; ECCN: 3A991D Fake Threat In the Open Market: 46 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z045
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Description
Win Source Part Number: 1227469-XC7Z045-L2FB G676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XC7Z045L2FBG676I; ECCN: 3A991D Fake Threat In the Open Market: 46 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z045
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Suppliers

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Product
Description
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Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1227469-XC7Z045-L2FBG676I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1227469-XC7Z045-L2FBG676I
Win Source Part Number: 1227469-XC7Z045-L2FB G676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XC7Z045L2FBG676I; ECCN: 3A991D Fake Threat In the Open Market: 46 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z045

Win Source Part Number: 1227469-XC7Z045-L2FBG676I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 800MHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XC7Z045L2FBG676I;
ECCN: 3A991D
Fake Threat In the Open Market: 46 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XC7Z045

Buy Now Datasheet
Shenzhen, China
Embedded - System On Chip (SoC)
XC7Z045-L2FBG676I
Embedded - System On Chip (SoC) XC7Z045-L2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA

IC SOC CORTEX-A9 800MHZ 676FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XC7Z045-L2FBG676I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XC7Z045-L2FBG676I
System On Chip (SoC) XC7Z045-L2FBG676I
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 800MHz 676-FCBGA (27x27)

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Technical Specifications

  Win Source Electronics Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1227469-XC7Z045-L2FBG676I XC7Z045-L2FBG676I XC7Z045-L2FBG676I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case Tray 676-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 130 #
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