Win Source Part Number: 1383892-XC7Z045-3FFG
Category: Integrated Circuits (ICs)>Embedded>Syste
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 1GHz
Package: Tray
Standard Package: 1 pcs
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
ECCN: 3A991D
Fake Threat In the Open Market: 48 pct.
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: Amd
Base Product Number: XC7Z045
Moisture Sensitivity Level (MSL): 4 (72 Hours)
IC SOC CORTEX-A9 1GHZ 676FCBGA
IC SOC CORTEX-A9 1GHZ 676FCBGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 1GHz 676-FCBGA (27x27)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 1GHz 676-FCBGA (27x27)
| Win Source Electronics | ODG (Origin Data Global) | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1383892-XC7Z045-3FFG676E | XC7Z045-3FFG676E | XC7Z045-3FFG676E | XC7Z045-3FFG676E |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | Tray | 676-BBGA, FCBGA | ||
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB | |
| Number of Inputs/Outputs | 130 # |
