Advanced Micro Devices, Inc. System On Chip (SoC) XC7Z045-3FBG676E

Description
IC SOC CORTEX-A9 1GHZ 676FCBGA
  • System On Chip (SoC) - XC7Z045-3FBG676E - ODG (Origin Data Global)
    ODG (Origin Data Global)
  • System On Chip (SoC) - XC7Z045-3FBG676E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
  • System On Chip (SoC) - XC7Z045-3FBG676E - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
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Description
IC SOC CORTEX-A9 1GHZ 676FCBGA
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
System On Chip (SoC) - XC7Z045-3FBG676E - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XC7Z045-3FBG676E
System On Chip (SoC) XC7Z045-3FBG676E
IC SOC CORTEX-A9 1GHZ 676FCBGA

IC SOC CORTEX-A9 1GHZ 676FCBGA

Supplier's Site Datasheet
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1105706-XC7Z045-3FBG676E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1105706-XC7Z045-3FBG676E
Win Source Part Number: 1105706-XC7Z045-3FBG 676E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 1GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): AM5726BABCX; XC7Z030-3FBG484E; MCIMX6D4AVT10AC; XC7Z045-2FFG676E; XC7Z045-2FFG900I; MCIMX6D6AVT10AD; MCIMX6D5EYM10ADXC7Z0 453FBG676E; ECCN: 3A991D Fake Threat In the Open Market: 57 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z045

Win Source Part Number: 1105706-XC7Z045-3FBG676E
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 1GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): AM5726BABCX; XC7Z030-3FBG484E; MCIMX6D4AVT10AC; XC7Z045-2FFG676E; XC7Z045-2FFG900I; MCIMX6D6AVT10AD; MCIMX6D5EYM10ADXC7Z0453FBG676E;
ECCN: 3A991D
Fake Threat In the Open Market: 57 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XC7Z045

Buy Now Datasheet
Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XC7Z045-3FBG676E
Embedded - System On Chip (SoC) XC7Z045-3FBG676E
IC SOC CORTEX-A9 1GHZ 676FCBGA

IC SOC CORTEX-A9 1GHZ 676FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XC7Z045-3FBG676E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XC7Z045-3FBG676E
System On Chip (SoC) XC7Z045-3FBG676E
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 1GHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 1GHz 676-FCBGA (27x27)

Buy Now
System On Chip (SoC) - XC7Z045-3FBG676E - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XC7Z045-3FBG676E
System On Chip (SoC) XC7Z045-3FBG676E
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 1GHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 1GHz 676-FCBGA (27x27)

Buy Now

Technical Specifications

  ODG (Origin Data Global) Win Source Electronics Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number XC7Z045-3FBG676E 1105706-XC7Z045-3FBG676E XC7Z045-3FBG676E XC7Z045-3FBG676E
Product Name System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Package / Case Tray 676-BBGA, FCBGA
Number of Inputs/Outputs 130 #
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