Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z045-2FFG900CES

Description
Win Source Part Number: 1003258-XC7Z045-2FFG 900CES Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 85°C (TJ) ECCN: 3A001A7B Fake Threat In the Open Market: 47 pct. MSL Level: 4 (72 Hours) HTSUS: 8542.39.0001 Mfr: AMD Xilinx Other Names: 122-1823 Base Product Number: XC7Z045 Product Status: Obsolete
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Description
Win Source Part Number: 1003258-XC7Z045-2FFG 900CES Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 85°C (TJ) ECCN: 3A001A7B Fake Threat In the Open Market: 47 pct. MSL Level: 4 (72 Hours) HTSUS: 8542.39.0001 Mfr: AMD Xilinx Other Names: 122-1823 Base Product Number: XC7Z045 Product Status: Obsolete
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Suppliers

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Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1003258-XC7Z045-2FFG900CES
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1003258-XC7Z045-2FFG900CES
Win Source Part Number: 1003258-XC7Z045-2FFG 900CES Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 85°C (TJ) ECCN: 3A001A7B Fake Threat In the Open Market: 47 pct. MSL Level: 4 (72 Hours) HTSUS: 8542.39.0001 Mfr: AMD Xilinx Other Names: 122-1823 Base Product Number: XC7Z045 Product Status: Obsolete

Win Source Part Number: 1003258-XC7Z045-2FFG900CES
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 800MHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: 0°C ~ 85°C (TJ)
ECCN: 3A001A7B
Fake Threat In the Open Market: 47 pct.
MSL Level: 4 (72 Hours)
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Other Names: 122-1823
Base Product Number: XC7Z045
Product Status: Obsolete

Buy Now Datasheet
System On Chip (SoC) - XC7Z045-2FFG900CES - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 800MHz 900-FCBGA (31x31)

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Embedded - System On Chip (SoC) - XC7Z045-2FFG900CES - Lingto Electronic Limited
Shenzhen, China
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Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1003258-XC7Z045-2FFG900CES XC7Z045-2FFG900CES XC7Z045-2FFG900CES
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case Tray 900-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 130 #
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