Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z030-L2FFG676I

Description
Win Source Part Number: 1033443-XC7Z030-L2FF G676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): AM5726BABCXA; XC7Z030-2FBG484E; XC7Z030-3FBG484E; XC7Z030-1FBG484C; XC7Z030-2FBG484I; XC7Z030-1FBG484IXC7Z 030L2FFG676I; ECCN: 3A991D Fake Threat In the Open Market: 55 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z030
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Description
Win Source Part Number: 1033443-XC7Z030-L2FF G676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): AM5726BABCXA; XC7Z030-2FBG484E; XC7Z030-3FBG484E; XC7Z030-1FBG484C; XC7Z030-2FBG484I; XC7Z030-1FBG484IXC7Z 030L2FFG676I; ECCN: 3A991D Fake Threat In the Open Market: 55 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z030
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Suppliers

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Product
Description
Supplier Links
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1033443-XC7Z030-L2FFG676I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1033443-XC7Z030-L2FFG676I
Win Source Part Number: 1033443-XC7Z030-L2FF G676I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 800MHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 130 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): AM5726BABCXA; XC7Z030-2FBG484E; XC7Z030-3FBG484E; XC7Z030-1FBG484C; XC7Z030-2FBG484I; XC7Z030-1FBG484IXC7Z 030L2FFG676I; ECCN: 3A991D Fake Threat In the Open Market: 55 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z030

Win Source Part Number: 1033443-XC7Z030-L2FFG676I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 800MHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): AM5726BABCXA; XC7Z030-2FBG484E; XC7Z030-3FBG484E; XC7Z030-1FBG484C; XC7Z030-2FBG484I; XC7Z030-1FBG484IXC7Z030L2FFG676I;
ECCN: 3A991D
Fake Threat In the Open Market: 55 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XC7Z030

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System On Chip (SoC) - XC7Z030-L2FFG676I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XC7Z030-L2FFG676I
System On Chip (SoC) XC7Z030-L2FFG676I
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 800MHz 676-FCBGA (27x27)

Buy Now
System On Chip (SoC) - XC7Z030-L2FFG676I - ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XC7Z030-L2FFG676I
System On Chip (SoC) XC7Z030-L2FFG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA

IC SOC CORTEX-A9 800MHZ 676FCBGA

Supplier's Site Datasheet
Embedded - System On Chip (SoC) - XC7Z030-L2FFG676I - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XC7Z030-L2FFG676I
Embedded - System On Chip (SoC) XC7Z030-L2FFG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA

IC SOC CORTEX-A9 800MHZ 676FCBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. ODG (Origin Data Global) Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1033443-XC7Z030-L2FFG676I XC7Z030-L2FFG676I XC7Z030-L2FFG676I XC7Z030-L2FFG676I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case Tray 676-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 130 #
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