Win Source Part Number: 1010822-XC7Z030-1FFG
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 667MHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 130
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Temperature Range - Operating: 0°C ~ 85°C (TJ)
ECCN: 3A991D
Fake Threat In the Open Market: 68 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Other Names: 122-1891
Base Product Number: XC7Z030
IC SOC CORTEX-A9 667MHZ 676FCBGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 667MHz 676-FCBGA (27x27)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 667MHz 676-FCBGA (27x27)
IC SOC CORTEX-A9 667MHZ 676FCBGA
| Win Source Electronics | ODG (Origin Data Global) | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1010822-XC7Z030-1FFG676C | XC7Z030-1FFG676C | XC7Z030-1FFG676C | XC7Z030-1FFG676C |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) |
| Processor Core | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | Tray | 676-BBGA, FCBGA | ||
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB | |
| Number of Inputs/Outputs | 130 # |
