Win Source Part Number: 1195394-XC7Z010-L1CL
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 667MHz
Package: Tray
Standard Package: 160
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 86
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XC7Z010L1CLG225I;
ECCN: EAR99
Fake Threat In the Open Market: 53 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XC7Z010
IC SOC CORTEX-A9 667MHZ 225BGA
IC SOC CORTEX-A9 667MHZ 225BGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 28K Logic Cells 667MHz 225-CSPBGA (13x13)
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 28K Logic Cells 667MHz 225-CSPBGA (13x13)
| Win Source Electronics | ODG (Origin Data Global) | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1195394-XC7Z010-L1CLG225I | XC7Z010-L1CLG225I | XC7Z010-L1CLG225I | XC7Z010-L1CLG225I |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) | System On Chip (SoC) |
| Processor Core | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | Tray | 225-LFBGA, CSPBGA | ||
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB | |
| Number of Inputs/Outputs | 86 # |
