Win Source Part Number: 1380319-XC7Z007S-2CL
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Fake Threat In the Open Market: 48 pct.
MSL Level: 3 (168 Hours)
Mfr: AMD
Series: Zynq®-7000
Package: Tray
Product Status: Active
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)
Base Product Number: XC7Z007
HTSUS: 8542.39.0001
REACH Status: REACH Unaffected
ECCN: 3A991D
Speed: 766MHz
Number of I/O: 54
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
IC SOC CORTEX-A9 766MHZ 225BGA
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 23K Logic Cells 766MHz 225-CSPBGA (13x13)
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 23K Logic Cells 766MHz 225-CSPBGA (13x13)
IC SOC CORTEX-A9 766MHZ 225BGA
| Win Source Electronics | ODG (Origin Data Global) | Quarktwin Technology Ltd. | Lingto Electronic Limited | |
|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | 1380319-XC7Z007S-2CLG225E | XC7Z007S-2CLG225E | XC7Z007S-2CLG225E | XC7Z007S-2CLG225E |
| Product Name | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) | System On Chip (SoC) | System On Chip (SoC) | Embedded - System On Chip (SoC) |
| Processor Core | ARM | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | ARM; Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | Tray | 225-LFBGA, CSPBGA | ||
| RAM Size | 0.2560 MB | 0.2560 MB | 0.2560 MB | |
| Number of Inputs/Outputs | 54 # |
