Advanced Micro Devices, Inc. Memory - Configuration Proms for FPGAs XC17S05XLPD8I

Description
IC PROM PROG I-TEMP 3.3V 8-DIP
  • Memory - Configuration Proms for FPGAs - XC17S05XLPD8I - Lingto Electronic Limited
    Lingto Electronic Limited
Datasheet
Description
IC PROM PROG I-TEMP 3.3V 8-DIP
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - Configuration Proms for FPGAs - XC17S05XLPD8I - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Memory - Configuration Proms for FPGAs
XC17S05XLPD8I
Memory - Configuration Proms for FPGAs XC17S05XLPD8I
IC PROM PROG I-TEMP 3.3V 8-DIP

IC PROM PROG I-TEMP 3.3V 8-DIP

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category Memory Chips
Product Number XC17S05XLPD8I
Product Name Memory - Configuration Proms for FPGAs
Operating Temperature -40 to 85 C (-40 to 185 F)
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 3229P2836 - Lingto Electronic Limited
Rochester Electronics
Memory
3229P2836
View Details
Infineon Technologies AG
Integrated Circuits (ICs) - Memory - Memory
40060431
View Details
Logic - Logic - FIFOs Memory - 74S225N - 053814-74S225N - Win Source Electronics
Texas Instruments
Logic - Logic - FIFOs Memory - 74S225N
74S225N
Specs
Memory Category FIFO
Data Rate 10 MHz
Operating Temperature 0 to 70 C (32 to 158 F)
View Details
5V Memory IC and Storage Component - 774-MT5C1009CW70L883C - ERSAELECTRONICS PTE. LTD.
Micross Components, Inc.
5V Memory IC and Storage Component
MT5C1009CW70L883C
Specs
Memory Category SRAM Chip
Operating Temperature -55 C (-67 F)
Density 1000 kbits
View Details
2 suppliers