Advanced Micro Devices, Inc. AMD Opteron™ 6300 Series Server Processor 6308

Description
Power your cloud with AMD Opteron™ processors When demanding workloads push the limits of your data center, push back with AMD Opteron 6300 series processors built to deliver the performance you need at the price you want. Low acquisition costs that help reduce overall TCO Scalable architecture ideal for cloud deployments Performance FEATURE FUNCTION END-USER BENEFIT Second generation of AMD's modular core architecture – codenamed "Piledriver" Higher performance and higher performance/watt than the previous generation Same power bands and power saving features Socket compatible Low TCO with better performance1 and price/performance2 Runs applications faster1 within the same power budget Helps extend life of investment by leveraging current socket platforms Cache and Core Count Up to 16 cores within the same package, 1MB of L2 cache per core (with up to 16MB of L2 cache per socket), and shared 16MB of L3 cache per socket. Helps improves performance and performance/watt for multi-threaded environments like virtualization, database and web serving. Higher DDR3 Frequencies Supports DDR3-1600 for typical memory configurations and DDR3-1866 for slightly loaded memory configurations. Helps improve system performance. Quad Channel Memory Four DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM and UDIMM. Can increase performance, especially in memory-intensive workloads. AMD Turbo CORE Technology Cores can boost performance by up to 300MHz simultaneously when headroom is available. Adds clock speed for improved performance. AES Instructions Provides hardware acceleration for fast and secure data encryption and decryption. Helps improve application performance. TDP Power Cap Thermal design power (TDP) can be set in one watt increments using the BIOS or APML to get the most processing power into a single rack. Offers more control over power settings and the flexibility to set power limits without capping CPU frequencies. C6 Power State Core power gating reduces and increases voltage as needed. Helps reduce power costs during times of low usage. AMD-P 2.0 FEATURE FUNCTION END-USER BENEFIT APML (Advanced Platform Management Link) Enables monitoring and controlling of system resources via a Remote Power Management Interface (RPMI) and Precision Thermal Monitor(in APML-enabled platforms). Remotely monitor and control power and cooling. AMD CoolSpeed Technology Server automatically drops into lower power mode if processor's temperature exceeds safe operational limits. Platform providers can safely reduce system fan speeds to deliver greater platform efficiency. Helps protect processor from overheating. C1E Reduces power to memory controller and HyperTransport™ technology links. Helps reduce power consumption. LV-DDR3 Support Supports DDR3 at 1.25V in addition to 1.35V. Helps reduce power consumption. LR-DIMM Support Enables extremely dense memory configurations. Helps reduce memory-bottleneck in memory intensive environments such as virtualization. Direct Connect Architecture 2.0 FEATURE FUNCTION END-USER BENEFIT HyperTransport™ Technology Assist (HT Assist) Helps to increase coherent memory bandwidth and reduces latency in multi-node systems by reducing cache probe traffic between cores. Helps improve system efficiency and scalability. HyperTransport™ 3.0 Technology (HT3) Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3. Helps improve system balance and scalability. AMD-V™ 2.0 Technology FEATURE FUNCTION END-USER BENEFIT AMD Virtualization™ (AMD-V™) 2.0 Technology Tagged TLB - Efficient switching between virtual machines for better application responsiveness Rapid Virtualization Indexing - Hardware-based virtual machine memory management AMD-V™ Technology Extended Migration - Helps enable live migration of VMs between all available AMD Opteron™ processor generations I/O Virtualization - Enables direct device access by a virtual machine for increased integrity and security Easy to deploy - Larger pool of resources enables greater VM consolidation Easy to manage - Common architecture makes managing virtual pools easy Easy to move - Extended migration delivers great flexibility for load balancing and disaster recovery
  • AMD Opteron™ 6300 Series Server Processor - 6308 - Advanced Micro Devices, Inc.
    Advanced Micro Devices, Inc.
Description
Power your cloud with AMD Opteron™ processors When demanding workloads push the limits of your data center, push back with AMD Opteron 6300 series processors built to deliver the performance you need at the price you want. Low acquisition costs that help reduce overall TCO Scalable architecture ideal for cloud deployments Performance FEATURE FUNCTION END-USER BENEFIT Second generation of AMD's modular core architecture – codenamed "Piledriver" Higher performance and higher performance/watt than the previous generation Same power bands and power saving features Socket compatible Low TCO with better performance1 and price/performance2 Runs applications faster1 within the same power budget Helps extend life of investment by leveraging current socket platforms Cache and Core Count Up to 16 cores within the same package, 1MB of L2 cache per core (with up to 16MB of L2 cache per socket), and shared 16MB of L3 cache per socket. Helps improves performance and performance/watt for multi-threaded environments like virtualization, database and web serving. Higher DDR3 Frequencies Supports DDR3-1600 for typical memory configurations and DDR3-1866 for slightly loaded memory configurations. Helps improve system performance. Quad Channel Memory Four DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM and UDIMM. Can increase performance, especially in memory-intensive workloads. AMD Turbo CORE Technology Cores can boost performance by up to 300MHz simultaneously when headroom is available. Adds clock speed for improved performance. AES Instructions Provides hardware acceleration for fast and secure data encryption and decryption. Helps improve application performance. TDP Power Cap Thermal design power (TDP) can be set in one watt increments using the BIOS or APML to get the most processing power into a single rack. Offers more control over power settings and the flexibility to set power limits without capping CPU frequencies. C6 Power State Core power gating reduces and increases voltage as needed. Helps reduce power costs during times of low usage. AMD-P 2.0 FEATURE FUNCTION END-USER BENEFIT APML (Advanced Platform Management Link) Enables monitoring and controlling of system resources via a Remote Power Management Interface (RPMI) and Precision Thermal Monitor(in APML-enabled platforms). Remotely monitor and control power and cooling. AMD CoolSpeed Technology Server automatically drops into lower power mode if processor's temperature exceeds safe operational limits. Platform providers can safely reduce system fan speeds to deliver greater platform efficiency. Helps protect processor from overheating. C1E Reduces power to memory controller and HyperTransport™ technology links. Helps reduce power consumption. LV-DDR3 Support Supports DDR3 at 1.25V in addition to 1.35V. Helps reduce power consumption. LR-DIMM Support Enables extremely dense memory configurations. Helps reduce memory-bottleneck in memory intensive environments such as virtualization. Direct Connect Architecture 2.0 FEATURE FUNCTION END-USER BENEFIT HyperTransport™ Technology Assist (HT Assist) Helps to increase coherent memory bandwidth and reduces latency in multi-node systems by reducing cache probe traffic between cores. Helps improve system efficiency and scalability. HyperTransport™ 3.0 Technology (HT3) Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3. Helps improve system balance and scalability. AMD-V™ 2.0 Technology FEATURE FUNCTION END-USER BENEFIT AMD Virtualization™ (AMD-V™) 2.0 Technology Tagged TLB - Efficient switching between virtual machines for better application responsiveness Rapid Virtualization Indexing - Hardware-based virtual machine memory management AMD-V™ Technology Extended Migration - Helps enable live migration of VMs between all available AMD Opteron™ processor generations I/O Virtualization - Enables direct device access by a virtual machine for increased integrity and security Easy to deploy - Larger pool of resources enables greater VM consolidation Easy to manage - Common architecture makes managing virtual pools easy Easy to move - Extended migration delivers great flexibility for load balancing and disaster recovery

Suppliers

Company
Product
Description
Supplier Links
AMD Opteron™ 6300 Series Server Processor - 6308 - Advanced Micro Devices, Inc.
Advanced Micro Devices, Inc.
Sunnyvale, CA, USA
AMD Opteron™ 6300 Series Server Processor
6308
AMD Opteron™ 6300 Series Server Processor 6308
Power your cloud with AMD Opteron™ processors When demanding workloads push the limits of your data center, push back with AMD Opteron 6300 series processors built to deliver the performance you need at the price you want. Low acquisition costs that help reduce overall TCO Scalable architecture ideal for cloud deployments Performance FEATURE FUNCTION END-USER BENEFIT Second generation of AMD's modular core architecture – codenamed "Piledriver" Higher performance and higher performance/watt than the previous generation Same power bands and power saving features Socket compatible Low TCO with better performance1 and price/performance2 Runs applications faster1 within the same power budget Helps extend life of investment by leveraging current socket platforms Cache and Core Count Up to 16 cores within the same package, 1MB of L2 cache per core (with up to 16MB of L2 cache per socket), and shared 16MB of L3 cache per socket. Helps improves performance and performance/watt for multi-threaded environments like virtualization, database and web serving. Higher DDR3 Frequencies Supports DDR3-1600 for typical memory configurations and DDR3-1866 for slightly loaded memory configurations. Helps improve system performance. Quad Channel Memory Four DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM and UDIMM. Can increase performance, especially in memory-intensive workloads. AMD Turbo CORE Technology Cores can boost performance by up to 300MHz simultaneously when headroom is available. Adds clock speed for improved performance. AES Instructions Provides hardware acceleration for fast and secure data encryption and decryption. Helps improve application performance. TDP Power Cap Thermal design power (TDP) can be set in one watt increments using the BIOS or APML to get the most processing power into a single rack. Offers more control over power settings and the flexibility to set power limits without capping CPU frequencies. C6 Power State Core power gating reduces and increases voltage as needed. Helps reduce power costs during times of low usage. AMD-P 2.0 FEATURE FUNCTION END-USER BENEFIT APML (Advanced Platform Management Link) Enables monitoring and controlling of system resources via a Remote Power Management Interface (RPMI) and Precision Thermal Monitor(in APML-enabled platforms). Remotely monitor and control power and cooling. AMD CoolSpeed Technology Server automatically drops into lower power mode if processor's temperature exceeds safe operational limits. Platform providers can safely reduce system fan speeds to deliver greater platform efficiency. Helps protect processor from overheating. C1E Reduces power to memory controller and HyperTransport™ technology links. Helps reduce power consumption. LV-DDR3 Support Supports DDR3 at 1.25V in addition to 1.35V. Helps reduce power consumption. LR-DIMM Support Enables extremely dense memory configurations. Helps reduce memory-bottleneck in memory intensive environments such as virtualization. Direct Connect Architecture 2.0 FEATURE FUNCTION END-USER BENEFIT HyperTransport™ Technology Assist (HT Assist) Helps to increase coherent memory bandwidth and reduces latency in multi-node systems by reducing cache probe traffic between cores. Helps improve system efficiency and scalability. HyperTransport™ 3.0 Technology (HT3) Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3. Helps improve system balance and scalability. AMD-V™ 2.0 Technology FEATURE FUNCTION END-USER BENEFIT AMD Virtualization™ (AMD-V™) 2.0 Technology Tagged TLB - Efficient switching between virtual machines for better application responsiveness Rapid Virtualization Indexing - Hardware-based virtual machine memory management AMD-V™ Technology Extended Migration - Helps enable live migration of VMs between all available AMD Opteron™ processor generations I/O Virtualization - Enables direct device access by a virtual machine for increased integrity and security Easy to deploy - Larger pool of resources enables greater VM consolidation Easy to manage - Common architecture makes managing virtual pools easy Easy to move - Extended migration delivers great flexibility for load balancing and disaster recovery

Power your cloud with AMD Opteron™ processors

When demanding workloads push the limits of your data center, push back with AMD Opteron 6300 series processors built to deliver the performance you need at the price you want.

  • Low acquisition costs that help reduce overall TCO
  • Scalable architecture ideal for cloud deployments

Performance

FEATURE

FUNCTION

END-USER BENEFIT

Second generation of AMD's modular core architecture – codenamed "Piledriver"
  • Higher performance and higher performance/watt than the previous generation
  • Same power bands and power saving features
  • Socket compatible
  • Low TCO with better performance1 and price/performance2
  • Runs applications faster1 within the same power budget
  • Helps extend life of investment by leveraging current socket platforms
Cache and Core CountUp to 16 cores within the same package, 1MB of L2 cache per core (with up to 16MB of L2 cache per socket), and shared 16MB of L3 cache per socket.Helps improves performance and performance/watt for multi-threaded environments like virtualization, database and web serving.
Higher DDR3 FrequenciesSupports DDR3-1600 for typical memory configurations and DDR3-1866 for slightly loaded memory configurations.Helps improve system performance.
Quad Channel MemoryFour DDR3 memory channels with max memory bandwidth of up to 51.2 GB/s @ DDR3-1600 with RDIMM, LRDIMM, LV RDIMM and UDIMM.Can increase performance, especially in memory-intensive workloads.
AMD Turbo CORE TechnologyCores can boost performance by up to 300MHz simultaneously when headroom is available.Adds clock speed for improved performance.
AES InstructionsProvides hardware acceleration for fast and secure data encryption and decryption.Helps improve application performance.
TDP Power CapThermal design power (TDP) can be set in one watt increments using the BIOS or APML to get the most processing power into a single rack.Offers more control over power settings and the flexibility to set power limits without capping CPU frequencies.
C6 Power StateCore power gating reduces and increases voltage as needed.Helps reduce power costs during times of low usage.

AMD-P 2.0

FEATURE

FUNCTION

END-USER BENEFIT

APML (Advanced Platform Management Link)Enables monitoring and controlling of system resources via a Remote Power Management Interface (RPMI) and Precision Thermal Monitor(in APML-enabled platforms).Remotely monitor and control power and cooling.
AMD CoolSpeed TechnologyServer automatically drops into lower power mode if processor's temperature exceeds safe operational limits. Platform providers can safely reduce system fan speeds to deliver greater platform efficiency.Helps protect processor from overheating.
C1EReduces power to memory controller and HyperTransport™ technology links.Helps reduce power consumption.
LV-DDR3 SupportSupports DDR3 at 1.25V in addition to 1.35V.Helps reduce power consumption.
LR-DIMM SupportEnables extremely dense memory configurations.Helps reduce memory-bottleneck in memory intensive environments such as virtualization.

Direct Connect Architecture 2.0

FEATURE

FUNCTION

END-USER BENEFIT

HyperTransport™ Technology Assist (HT Assist)Helps to increase coherent memory bandwidth and reduces latency in multi-node systems by reducing cache probe traffic between cores.Helps improve system efficiency and scalability.
HyperTransport™ 3.0 Technology (HT3)Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3.Helps improve system balance and scalability.

AMD-V™ 2.0 Technology

FEATURE

FUNCTION

END-USER BENEFIT

AMD Virtualization™ (AMD-V™) 2.0 Technology
  • Tagged TLB - Efficient switching between virtual machines for better application responsiveness
  • Rapid Virtualization Indexing - Hardware-based virtual machine memory management
  • AMD-V™ Technology Extended Migration - Helps enable live migration of VMs between all available AMD Opteron™ processor generations
  • I/O Virtualization - Enables direct device access by a virtual machine for increased integrity and security
  • Easy to deploy - Larger pool of resources enables greater VM consolidation
  • Easy to manage - Common architecture makes managing virtual pools easy
  • Easy to move - Extended migration delivers great flexibility for load balancing and disaster recovery
Supplier's Site

Technical Specifications

  Advanced Micro Devices, Inc.
Product Category CPU Chips
Product Number 6308
Product Name AMD Opteron™ 6300 Series Server Processor
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