Advanced Interconnections Corp. Flip-Top™ BGA Socket Series

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Flip-Top™ BGA Socket Series -  - Advanced Interconnections Corp.
West Warwick, RI, United States
Flip-Top™ BGA Socket Series
Flip-Top™ BGA Socket Series
Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection.

Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection.

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Technical Specifications

  Advanced Interconnections Corp.
Product Category IC Interconnect Components
Product Name Flip-Top™ BGA Socket Series
Mounting SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball
Socket Type BGA; LGA; Test
Product Type IC Socket
Contacts Pitch 1 to 1.27 mm (0.0394 to 0.0500 inches)
Contact Plating Gold (optional feature); Tin/Lead
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