Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. Our compact Flip-Top™ BGA Sockets require no external hold-downs and use less PC board space than most test sockets. The patent-pending pressure retention clamp, with integral heat sink, ensures a reliable connection.
| Advanced Interconnections Corp. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Name | Flip-Top™ BGA Socket Series |
| Mounting | SMT (optional feature); Through-Hole (optional feature); Solder; Solder Ball |
| Socket Type | BGA; LGA; Test |
| Product Type | IC Socket |
| Contacts Pitch | 1 to 1.27 mm (0.0394 to 0.0500 inches) |
| Contact Plating | Gold (optional feature); Tin/Lead |
