TO-3P Ceramic heat sinks and thermal pads are designed to provide superior thermal performance in advanced thermal management solution such as high power applications, particularly for insulated-gate bipolar transistor (IGBT) modules. These heat sinks have advantages of heat dissipation, electrical insulation and mechanical stability which extended service life of power electronics in hard environments.
Xiamen Innovacera Advanced Materials Co., Ltd. | |
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Product Category | Industrial Ceramic Materials |
Product Name | TO-3P Ceramic Heat Sink |
Shape / Form | WaferSubstrate |