Wafer World, Inc. 2321

Description
Characteristics Materials: Germanium Diameter: 76.2 Dopant: Undoped Orientation: (100) Resistivity-Actual: >40 Thickness-actual: 300-350 Surface: P/P Grade: EPI Misc Info. Growth Method: CZ Lot Size: 1
  • 2321 - Wafer World, Inc.
    Wafer World, Inc.
Description
Characteristics Materials: Germanium Diameter: 76.2 Dopant: Undoped Orientation: (100) Resistivity-Actual: >40 Thickness-actual: 300-350 Surface: P/P Grade: EPI Misc Info. Growth Method: CZ Lot Size: 1

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Company
Product
Description
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- 2321 - Wafer World, Inc.
Wafer World, Inc.
West Palm Beach, FL, USA
2321
2321
Characteristics Materials: Germanium Diameter: 76.2 Dopant: Undoped Orientation: (100) Resistivity-Actual: >40 Thickness-actual: 300-350 Surface: P/P Grade: EPI Misc Info. Growth Method: CZ Lot Size: 1

Characteristics Materials: Germanium Diameter: 76.2 Dopant: Undoped Orientation: (100) Resistivity-Actual: >40 Thickness-actual: 300-350 Surface: P/P Grade: EPI Misc Info. Growth Method: CZ Lot Size: 1

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Technical Specifications

  Wafer World, Inc.
Product Category Semiconducting Materials
Product Number 2321
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