Retsch, Inc. 60.150 Series

Description
The demands made of particle size analysis are constantly increasing. This is also reflected in the greater requirements made in the new standard ISO 3310. In order to adapt our test sieves to these new requirements, RETSCH has developed a completely new manufacturing process that guarantees a previously unattained quality and consistency in sieve production (200 x 50 mm, 200 x 25 mm, 203 x 50 mm (8"x 2"), 203 x 25 mm (8"x 1")). In addition, a logistic manufacturing system makes it possible to record each and every material used in the process.
Description
The demands made of particle size analysis are constantly increasing. This is also reflected in the greater requirements made in the new standard ISO 3310. In order to adapt our test sieves to these new requirements, RETSCH has developed a completely new manufacturing process that guarantees a previously unattained quality and consistency in sieve production (200 x 50 mm, 200 x 25 mm, 203 x 50 mm (8"x 2"), 203 x 25 mm (8"x 1")). In addition, a logistic manufacturing system makes it possible to record each and every material used in the process.

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60.150 Series -  - Retsch, Inc.
Newtown, PA, USA
60.150 Series
60.150 Series
The demands made of particle size analysis are constantly increasing. This is also reflected in the greater requirements made in the new standard ISO 3310. In order to adapt our test sieves to these new requirements, RETSCH has developed a completely new manufacturing process that guarantees a previously unattained quality and consistency in sieve production (200 x 50 mm, 200 x 25 mm, 203 x 50 mm (8"x 2"), 203 x 25 mm (8"x 1")). In addition, a logistic manufacturing system makes it possible to record each and every material used in the process.

The demands made of particle size analysis are constantly increasing. This is also reflected in the greater requirements made in the new standard ISO 3310. In order to adapt our test sieves to these new requirements, RETSCH has developed a completely new manufacturing process that guarantees a previously unattained quality and consistency in sieve production (200 x 50 mm, 200 x 25 mm, 203 x 50 mm (8"x 2"), 203 x 25 mm (8"x 1")). In addition, a logistic manufacturing system makes it possible to record each and every material used in the process.

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Technical Specifications

  Retsch, Inc.
Product Category Test Sieves
Product Name 60.150 Series
Standard Diameter 8"
Standard Heights 2"
Material Stainless Steel Frame and Cloth
Sieve Designation 5"(125mm) (optional feature); 4.24"(106mm) (optional feature); 4"(100mm) (optional feature); 3-1/2"(90mm) (optional feature); 3"(75mm) (optional feature); 2-1/2"(63mm) (optional feature); 2.12"(53mm) (optional feature); 2"(50mm) (optional feature); 1-3/4"(45mm) (optional feature); 1-1/2"(37.5mm) (optional feature); 1-1/4"(31.5mm) (optional feature); 1.06"(26.5mm) (optional feature); 1.00"(25.0mm) (optional feature); 7/8"(22.4mm) (optional feature); 3/4"(19.0mm) (optional feature); 5/8"(16.0mm) (optional feature); .530"(13.2mm) (optional feature); 1/2"(12.5mm) (optional feature); 7/16"(11.2mm) (optional feature); 3/8"(9.5mm) (optional feature); 5/16"(8.0mm) (optional feature); .265"(6.7mm) (optional feature); 1/4"(6.3mm) (optional feature); #3-1/2(5.6mm) (optional feature); #4(4.75mm) (optional feature); #5(4.0mm) (optional feature); #6(3.35mm) (optional feature); #7(2.8mm) (optional feature); #8(2.36mm) (optional feature); #10(2.0mm) (optional feature); #12(1.7mm) (optional feature); #14(1.4mm) (optional feature); #16(1.18mm) (optional feature); #18(1.0mm) (optional feature); #20(850µm) (optional feature); #25(710µm) (optional feature); #30(600µm) (optional feature); #35(500µm) (optional feature); #40(425µm) (optional feature); #45(355µm) (optional feature); #50(300µm) (optional feature); #60(250µm) (optional feature); #70(212µm) (optional feature); #80(180µm) (optional feature); #100(150µm) (optional feature); #120(125µm) (optional feature); #140(106µm) (optional feature); #170(90µm) (optional feature); #200(75µm) (optional feature); #230(63µm) (optional feature); #270(53µm) (optional feature); #325(45µm) (optional feature); #400(38µm) (optional feature); #450(32µm) (optional feature); #500(25µm) (optional feature); #635(20µm) (optional feature)
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