Umicore Metal Deposition Solutions EPIG process EPIG process

Description
Electroless palladium and semi-autocatalytic gold plating Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly. Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations. Advantages Nickel free coating Thin and very uniform electroless deposition Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design
  • EPIG process - EPIG process - Umicore Metal Deposition Solutions
    Umicore Metal Deposition Solutions
Description
Electroless palladium and semi-autocatalytic gold plating Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly. Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations. Advantages Nickel free coating Thin and very uniform electroless deposition Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design

Suppliers

Company
Product
Description
Supplier Links
EPIG process - EPIG process - Umicore Metal Deposition Solutions
Umicore Metal Deposition Solutions
Schwaebisch Gmuend, Germany
EPIG process
EPIG process
EPIG process EPIG process
Electroless palladium and semi-autocatalytic gold plating Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly. Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations. Advantages Nickel free coating Thin and very uniform electroless deposition Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design

Electroless palladium and semi-autocatalytic gold plating

Umicore´s palladium and gold plating process (EPIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly.
Due to its outstanding film characteristics EPIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high performance regarding soldering and bonding process signal transfer in combination with complying newest RoHs and WEEE regulations.

Advantages

  • Nickel free coating
  • Thin and very uniform electroless deposition
  • Suitable for (ultra) fine pitch layouts
  • Ductile film compatible for flex PCB applications
  • Dense and homogenous gold protection layer up to 0.3 μm feasible
  • High solderjoint reliability (SJR) due to low void formation
  • Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability

Applications

  • Flexboard PCB (FPC)
  • Multi-functional assembly
  • Fine pattern PCB design
Supplier's Site

Technical Specifications

  Umicore Metal Deposition Solutions
Product Category Plating Services
Product Number EPIG process
Product Name EPIG process
Unlock Full Specs
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