Umicore Metal Deposition Solutions DIG process DIG process

Description
Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance. Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding. Advantages Nickel free coating Deposits with high HF performance Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Low plating cost due to few process steps Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design
  • DIG process - DIG process - Umicore Metal Deposition Solutions
    Umicore Metal Deposition Solutions
Description
Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance. Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding. Advantages Nickel free coating Deposits with high HF performance Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Low plating cost due to few process steps Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design

Suppliers

Company
Product
Description
Supplier Links
DIG process - DIG process - Umicore Metal Deposition Solutions
Umicore Metal Deposition Solutions
Schwaebisch Gmuend, Germany
DIG process
DIG process
DIG process DIG process
Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance. Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding. Advantages Nickel free coating Deposits with high HF performance Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Low plating cost due to few process steps Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design

Plating of direct immersion gold

Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance.
Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding.

Advantages

  • Nickel free coating
  • Deposits with high HF performance
  • Suitable for (ultra) fine pitch layouts
  • Ductile film compatible for flex PCB applications
  • Dense and homogenous gold protection layer up to 0.3 μm feasible
  • High solderjoint reliability (SJR) due to low void formation
  • Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability
  • Low plating cost due to few process steps

Applications

  • Flexboard PCB (FPC)
  • Multi-functional assembly
  • Fine pattern PCB design
Supplier's Site
Umicore Materials
Raleigh, NC, USA
DIG process
DIG process
DIG process DIG process
Plating of direct immersion gold Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance. Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding. Advantages Nickel free coating Deposits with high HF performance Suitable for (ultra) fine pitch layouts Ductile film compatible for flex PCB applications Dense and homogenous gold protection layer up to 0.3 μm feasible High solderjoint reliability (SJR) due to low void formation Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability Low plating cost due to few process steps Applications Flexboard PCB (FPC) Multi-functional assembly Fine pattern PCB design

Plating of direct immersion gold

Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance.
Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding.

Advantages

  • Nickel free coating
  • Deposits with high HF performance
  • Suitable for (ultra) fine pitch layouts
  • Ductile film compatible for flex PCB applications
  • Dense and homogenous gold protection layer up to 0.3 μm feasible
  • High solderjoint reliability (SJR) due to low void formation
  • Excellent Al-, Au-, Cu-(Pd coated) and Ag-wire bondability
  • Low plating cost due to few process steps

Applications

  • Flexboard PCB (FPC)
  • Multi-functional assembly
  • Fine pattern PCB design

Technical Specifications

  Umicore Metal Deposition Solutions Umicore Materials
Product Category Plating Services Plating Services
Product Number DIG process DIG process
Product Name DIG process DIG process
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